IX5 Ultra Motherboard Preheating Platform PCB Heating Station for Phone Repair

Get smoother, more controlled board repairs with a motherboard preheating platform built for precision work. The IX5 Ultra provides adjustable 20–260°C heating across an aluminum alloy panel for consistent temperature distribution. Designed for phone repair technicians, it supports layering, tinning, laminating, degumming, and other motherboard rework tasks. Its universal clamping setup accommodates different mobile phone motherboard sizes, while the compact design keeps your workbench organized.

Key Features

• PCB preheating station with freely adjustable 20–260°C temperature control.
• Aluminum alloy heating panel distributes heat uniformly across the work area.
• Universal clamp helps securely hold different sizes of mobile phone motherboards.
• Supports layering, tinning, laminating, degumming, delamination, and dot matrix repair.
• Compact and lightweight construction is convenient for repair benches and technician workstations.
• Available in 110V and 220V versions depending on configuration.

Why Choose Our IX5 Ultra Preheating Platform

Unlike repair methods that rely primarily on a hot air gun or soldering iron for board heating, this phone motherboard repair tool provides a dedicated heated surface for more uniform preheating. Adjustable temperature control lets technicians match heat levels to different board-level repair processes, while the clamp keeps the motherboard positioned during detailed work.

Perfect For

• Mobile phone motherboard repair
• PCB and logic board rework
• Motherboard layering and delamination
• Tinning and lamination
• Adhesive and glue removal
• Dot matrix repair
• Phone repair shops and technician workbenches

Upgrade your repair setup with controlled, uniform heating that helps make detailed motherboard work more convenient and organized. Order the IX5 Ultra today and bring dependable preheating control to your workstation.