Lead-Free High Temperature Solder Paste Sn99 Ag0.3 Cu0.7 Needle Tube for Mobile Phone and LED Repair

Achieve professional-quality soldering results with the Lead-Free High-Temperature Solder Paste. This advanced formula — composed of 99% tin, 0.3% silver, and 0.7% copper (Sn99 Ag0.3 Cu0.7) — ensures excellent conductivity, strong adhesion, and smooth flow for precise electronic repairs. Ideal for mobile phone boards, USB sockets, LED lights, and PCB components, it delivers superior performance without the use of harmful lead.

Key Features

• Lead-Free Formula: Safe and eco-friendly solder paste for modern electronics, ensuring compliance with RoHS standards.

• High-Temperature Resistance: Melting point around 217–227°C, ideal for heat-intensive applications and durable solder joints.

• Excellent Conductivity: Provides stable electrical performance and strong bonding between components.

• Smooth Application: Needle tube design allows for precise dispensing — no mess, no waste.

• Multi-Purpose Use: Suitable for repairing mobile phones, USB ports, LED lighting, circuit boards, and small electronic parts.

• Oxidation Resistant: Maintains consistent performance over time, even in humid environments.

Why Choose Our Lead-Free Solder Paste

Unlike traditional soldering materials, this Sn99 Ag0.3 Cu0.7 formula combines high performance with environmental responsibility. It offers cleaner joints, less residue, and excellent flow — perfect for hobbyists, technicians, and professional repair engineers.

Perfect For

• Mobile phone motherboard repairs

• LED light soldering and rework

• USB socket and connector fixes

• Electronic circuit board assembly

Product Details

• Type: Lead-Free Solder Paste

• Composition: Sn99 Ag0.3 Cu0.7

• Form: Needle tube for precision use

• Melting Point: 217–227°C (approx.)

• Weight: 10g–50g (varies by size)

• Storage: Keep sealed and stored in a cool, dry place

• Shelf Life: 6–12 months

Tip: Preheat work surface before application for best results.